July 5, 2024

What is the difference between wave soldering and reflow soldering

Soldering is a crucial step in assembling printed circuit boards (PCBs). It's the process that holds everything together. Without soldering, the electronic components would not stay attached to the board, making soldering essential for the functionality and reliability of electronic devices.

There are two main methods of soldering in PCB manufacturing: wave soldering and reflow soldering. Each method has its unique process, advantages, and applications. Understanding the differences between these two methods is essential for anyone involved in PCB assembly.

Wave soldering is typically used for through-hole components, while reflow soldering is used for surface-mount components. Each method involves different equipment and processes, which can affect the final product's quality, cost, and efficiency.

In this article, we will explore the specifics of wave and reflow soldering and compare their processes, benefits, and ideal use cases. By the end, you will clearly understand which soldering method might best suit your PCB assembly needs.


What is Wave Soldering?

Wave soldering is fundamental for assembling printed circuit boards (PCBs). It's particularly effective for attaching through-hole components. The process gets its name from the wave of molten solder used to form connections. 

Let's delve deeper into how wave soldering works, the equipment involved, and its advantages and disadvantages.

Definition and Basic Process

Wave soldering involves moving a PCB over a wave of molten solder. A pump in a tank creates and maintains this wave. As the PCB passes through the wave, the solder adheres to the exposed metal areas of the board, forming solid electrical connections. This method is highly efficient and well-suited for large-scale production.

Step-by-Step Process

Understanding the wave soldering process can help you see why it's favored for certain types of PCB assembly. Here are the main steps involved:

Flux Application

The first step is applying flux. Flux is a chemical cleaning agent that removes oxides from metal surfaces. This step is crucial because it ensures a clean surface for the solder to bond with. The flux can be applied by spraying or foaming.


Next, the PCB undergoes a preheating stage. The purpose of preheating is to raise the PCB's temperature gradually. This helps prevent thermal shock when the board contacts the hot solder wave. Preheating also activates the flux, making it more effective.

Wave Contact

After preheating, the PCB moves to the wave contact stage. Here, the board passes over a wave of molten solder maintained at a constant temperature and height. As the PCB passes through, the solder wave touches the leads of the components, forming solder joints. This step is fast and ensures all connections are correctly soldered.


The final step is cooling. After the PCB has passed through the solder wave, it needs to cool down. Cooling solidifies the solder joints, securing the components in place. This can be done using incredible air jets or water sprays. Proper cooling is essential to prevent thermal stress and ensure strong joints.

For more details on through-hole assembly, visit 5G IoT PCB Assembly.

Advantages and Disadvantages

Wave soldering has several advantages and some disadvantages to consider:


  • Suitable for Through-Hole Components: Ideal for components that pass through the PCB.
  • Efficient for Mass Production: Can handle large volumes of PCBs quickly.
  • Even Solder Deposition: Provides consistent and even solder joints.


  • Not Suitable for Surface Mount Components: Best used for through-hole components, not surface mount.
  • Sensitive to Temperature Control: Requires precise temperature management to avoid defects.

What is Reflow Soldering?

Reflow soldering is famous for assembling printed circuit boards (PCBs), especially for surface-mount technology (SMT) components. This process involves using solder paste and heat to form reliable solder joints. 

Let's explore how reflow soldering works, the equipment involved, and its advantages and disadvantages.

Definition and Basic Process

Reflow soldering is used to attach surface mount components to a PCB. The process starts by applying solder paste to the PCB pads, placing the components on the paste, and then heating the entire assembly in a reflow oven. This causes the solder paste to melt and form solid joints as it cools.

Step-by-Step Process

Here's a detailed look at the reflow soldering process:

Paste Printing

The first step in reflow soldering is paste printing. Solder paste, a mixture of powdered solder and flux, is applied to the PCB pads using a stencil. This ensures that the paste is only applied where needed, providing a precise amount for each connection.

Component Placement

Next, the components are placed on the PCB. This is done using a pick-and-place machine that accurately positions each component on the solder paste. The paste holds the components in place until they are soldered. Learn more about Optimal PCB Component Placement.


After the components are placed, the PCB moves into the reflow oven. The oven heats the board in a controlled manner, following a specific temperature profile. The solder paste melts, flows, and solidifies as the board cools, creating strong solder joints.


The final step is inspection. Post-reflow inspection is crucial to ensure the quality of the solder joints. Automated Optical Inspection (AOI) machines check for defects like insufficient solder, tombstoning, and misaligned components.

Equipment Used

Reflow soldering requires several key pieces of equipment to perform each step efficiently and accurately. Here's a look at the main components:

Solder Paste Printer

The solder paste printer applies the paste to the PCB. It uses a stencil to ensure the paste is deposited accurately on each pad, essential for creating reliable connections. Learn more about Solder Paste: A Comprehensive Guide for Electronics Manufacturing.

Pick and Place Machine

The pick-and-place machine positions the components on the PCB. It uses precise robotic arms to pick up components and place them on the solder paste, ensuring they are correctly aligned.

Reflow Oven

The reflow oven heats the PCB to melt the solder paste. It has multiple temperature zones to gradually heat and cool the board, following a specific profile to ensure proper soldering without damaging components.

Post-Reflow Inspection (AOI)

Automated Optical Inspection (AOI) machines inspect the solder joints after reflow. They use cameras and image processing software to detect defects, ensuring high-quality soldering.

Advantages and Disadvantages

Reflow soldering has several benefits and some drawbacks. Here's a summary:


  • Suitable for Surface Mount Components: Ideal for SMT components, which are commonly used in modern electronics.
  • Precise Component Placement: Ensures components are accurately positioned on the PCB.
  • Better for Fine-Pitch Components: Handles small, fine-pitch components well, making it suitable for high-density boards.


  • More Expensive: The equipment and process can be more costly than wave soldering.
  • Not Ideal for Through-Hole Components: Reflow soldering is primarily designed for surface mount components, not through-hole parts.

Detailed Comparison

Understanding the differences between wave soldering and reflow soldering can help you choose the best method for your PCB assembly needs. Let's dive into the key aspects of each process.

Process Differences

Wave soldering and reflow soldering follow different procedures to achieve similar results, such as attaching components to a PCB.

Wave Soldering Steps

  1. Flux Application: Flux is applied to the PCB to clean the metal surfaces.
  2. Preheating: The PCB is heated to prevent thermal shock.
  3. Wave Contact: The PCB passes over a molten solder wave, forming the solder joints.
  4. Cooling: The solder joints solidify as the PCB cools down.

Reflow Soldering Steps

  1. Paste Printing: Solder paste is applied to the PCB pads using a stencil.
  2. Component Placement: Components are placed on the solder paste.
  3. Reflow: The assembly is heated in a reflow oven, causing the solder paste to melt and form joints.
  4. Inspection: The solder joints are inspected for quality and defects.

For a more detailed guide on PCB manufacturing, visit A Complete Guide to the PCB Manufacturing Process.

Suitable Components

The type of components you are working with will often determine which soldering method is best.

Through-Hole Components

  • Wave Soldering: Ideal for through-hole components with leads that pass through the PCB.
  • Reflow Soldering: Not suitable, as it's primarily designed for surface mount components.

Surface Mount Components

  • Wave Soldering: It is unsuitable, as it needs to handle surface mount components effectively.
  • Reflow Soldering: Perfect for surface mount components, allowing precise placement and reliable joints.

Production Speed and Throughput

Each method offers different speeds and efficiencies.

High Throughput of Wave Soldering

  • Wave soldering is fast and can handle large volumes of PCBs simultaneously, making it ideal for mass production.

Slower, More Precise Reflow Soldering

  • Reflow soldering is slower due to its step-by-step process. However, it provides greater precision, making it suitable for complex and high-density boards.

Defect Rates and Quality Control

Defects can occur in both methods, but the types and rates vary.

Common Defects in Each Method

  • Wave Soldering: Prone to issues like solder bridging, shadowing, and insufficient solder.
  • Reflow Soldering: Can experience defects like tombstoning, voids, and head-in-pillow.

Methods of Inspection and Quality Control

  • Wave Soldering: Visual inspection and In-Circuit Testing (ICT) are commonly used.
  • Reflow Soldering: Automated Optical Inspection (AOI) and ICT are employed to ensure high-quality solder joints.

Cost and Efficiency

Cost is a significant factor when choosing a soldering method.

Initial Equipment Costs

  • Wave Soldering: Generally lower initial cost, making it a good choice for high-volume production.
  • Reflow Soldering: Higher initial cost due to the need for precise equipment like paste printers and reflow ovens.

Operational Costs

  • Wave Soldering: Often more cost-effective for large-scale operations.
  • Reflow Soldering: Higher operational costs, but the precision and quality can justify the expense for complex boards.

Energy Consumption

  • Wave Soldering: More energy-efficient as the solder remains molten.
  • Reflow Soldering: Consumes more energy due to repeated heating cycles, but optimizing profiles can reduce consumption.

Wave soldering and reflow soldering each have their strengths and weaknesses. Wave soldering is excellent for speed and cost-efficiency in large-scale productions, particularly with through-hole components. 

Reflow soldering excels in precision and is ideal for surface mount technology despite its higher cost and slower speed. 

Understanding these differences can help you select the best method for your PCB assembly needs.

Green PCB under a magnifying glass with tools

Applications and Use Cases

Choosing between wave soldering and reflow soldering depends on your project's specific requirements. Each method excels in different scenarios. Let's explore when to use each technique.

When to Use Wave Soldering

Wave soldering is particularly effective for certain types of production and industries. Here are some ideal applications:

High Mix, Medium Volume Production

Wave soldering is well-suited for projects that involve various PCBs but do not require extremely high production volumes. It offers the flexibility needed for diverse product lines while maintaining efficiency.

Automotive Electronics

The automotive industry often uses through-hole components for their durability and reliability. Wave soldering is perfect for these applications, ensuring strong and consistent solder joints that can withstand the demanding conditions in automotive environments.

Industrial Control Boards

Industrial control systems require robust and reliable PCBs. Wave soldering provides the durability needed for these components, making it a preferred method for assembling industrial control boards that must perform under harsh conditions.

When to Use Reflow Soldering

Reflow soldering is ideal for projects that demand precision and are typically involved in high-tech industries. Here are some prime use cases:

Consumer Electronics

Consumer electronics, such as smartphones, tablets, and wearables, require precise and reliable connections for their surface mount components. Reflow soldering is perfect for these high-density, fine-pitch boards, ensuring high quality and performance.

High-Density Computing Boards

In computing, especially in servers and high-performance computing systems, PCBs often have a high density of components. Reflow soldering excels in handling these complex assemblies, providing accurate placement and strong solder joints for small and closely spaced components.

Double-Sided SMD Boards

Reflow soldering is essential for double-sided surface mount device (SMD) boards. It allows for the precise application of solder paste and careful heating, ensuring that components on both sides of the PCB are securely attached without damaging the board.

For applications involving flexible PCBs, see A Guide for Flex PCB Design Requirements.

Wave soldering and reflow soldering each have ideal applications. Wave soldering is excellent for high-mix, medium-volume productions, automotive electronics, and industrial control boards. 

Reflow soldering, on the other hand, is the go-to method for consumer electronics, high-density computing boards, and double-sided SMD boards. 

By understanding the strengths of each method, you can choose the proper soldering process for your specific needs, ensuring optimal performance and reliability for your electronic assemblies.



Choosing the proper soldering method for your PCB assembly is critical. It impacts the quality, cost, and efficiency of your production process. Let's summarize the key points and look at future trends in soldering technology.

Summary of Key Points

Recap of Differences

  • Wave Soldering: Best for through-hole components, high-volume production, and lower initial costs. It's efficient but sensitive to temperature control.
  • Reflow Soldering: Ideal for surface mount components, offers precision, and is suitable for complex, high-density boards. It is more expensive but provides higher quality for delicate components.

Importance of Choosing the Right Soldering Method

Selecting the appropriate method based on your specific needs ensures:

  • Reliable and robust solder joints.
  • Cost-effective production.
  • High-quality end products.
  • Efficient use of resources and time.

Each PCB assembly project is unique. Consult our experts at Globalwellpcba to provide valuable insights and advice tailored to your needs. We can help you navigate the complexities of welding technology and choose the best method for your specific application.

Thank you for reading!

Article written by Alice Lee