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Photoelectric Rigid PCB

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Item Rigid PCB
Max Layer 60L
Inner Layer Min Trace/Space 3/3mil
Out Layer Min Trace/Space 3/3mil
Inner Layer Max Copper 6oz
Out Layer Max Copper 6oz
Min Mechanical Drilling 0.15mm
Min Laser Drilling 0.1mm
Aspect Ratio(Mechanical Drilling) 20:1
Aspect Ratio(Laser Drilling) 1:1
Press Fit Hole Ttolerance ±0.05mm
PTH Tolerance ±0.075mm
NPTH Tolerance ±0.05mm
Countersink Tolerance ±0.15mm
Board Thickness 0.4-8mm
Board Thickness Tolerance(<1.0mm) ±0.1mm
Board Thickness Tolerance(≥1.0mm) ±10%
Impedance Tolerance Single-Ended:±5Ω(≤50Ω),±7%(>50Ω)
Min Board Size 10*10mm
Max Board Size 22.5*30inch
Contour Tolerance ±0.1mm
Min BGA 7mil
Min SMT 7*10mil
Surface Treatment ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating
Solder Mask Green,Black,Blue,Red,Matt Green
Min Solder Mask Clearance 1.5mil
Min Solder Mask Dam 3mil
Legend White,Black,Red,Yellow
Min Legend Width/Height 4/23mil
Strain Fillet Width /
Bow & Twist 0.3%
Table of Contents
Primary Item (H2)

A rigid PCB is a solid circuit board with an inflexible structure. Due to their structure, they cannot be bent into small devices and must be made precisely. They are designed with several different layers, such as copper, substrate, solder mask, and silk screen. All these layers are joined together with adhesive.

In the case of photoelectric rigid PCB, we have a rigid circuit board section that has at least 1 conductor and insulating layer. It may also have a few flexible sections that allow bending and fitting into smaller electronic devices. They also have external electrical connection points to add substrate over optical elements. 

These are added to the rigid sections, while optical circuit components are added to the flexible sections. The photoelectric components of the rigid PCBs allow them to release more energy when electromagnetic radiation hits. In this article, we'll discuss photoelectric rigid PCBs in more detail and their features. 

Need For Photoelectric Rigid PCB

A printed circuit board (PCB) is useful in supporting and connecting electronic components via traces, pads, and sensors. These features are etched from copper sheets on a non-conductive substrate. 

PCBs vary as they can be single-sided, double-sided, or multi-layered. Connections between layers use plated-through holes called vias. Advanced PCBs may embed components like capacitors, or resistors in substrates

The growth of multimedia services, including telephone, cable TV, digital TV, and the Internet, drives demand for photoelectric PCBs due to increased bandwidth needs. In traditional systems, signal transmission and switching speeds are limited. 

For example, CPU frequencies are at 2-2.9 GHz, while telecommunication speeds reach gigabits per second. However, computer bus transmission lags at 10-100 Mbps, creating bottlenecks. So, these issues can be resolved with high-functioning PCB components. 

With advancements in technology, light-based internal computer and interconnection solutions are available. Parasitic parameters like resistance, inductance, and capacitance limit the transmission rate of wire connections. The parasitic parameters may also be impacted by the geometry of the PCB. 

FR-4 material operates at 70% of light speed, which is insufficient for many fields. Light-based interconnections offer advantages: larger bandwidth, lower transmission loss, reduced crosstalk, and magnetic interference. Optical transmission allows parallel transmission of multiple wavelengths.

In response, the photoelectric PCB concept integrates light and electricity for signal transmission, improving packaging substrates. This evolution from traditional PCBs integrates a light layer, merging electrical and optical transmission technologies.

Components of Photoelectric Rigid PCB

Here are the components of photoelectric PCBs. 

Printed Circuit Board (PCB)

The base material of the PCB is made using fiberglass reinforced with epoxy laminate. This part of the PCB offers a rigid structure to the board to add electrical components and vias. 

Photoelectric Components

Elements that respond to light and optic signals are added to the PCB. They can include light-emitting diodes, photodiodes, optical sensors, and phototransistors. These components ensure the photoelectric functionalities of the PCB. 

The optical elements are mounted over the rigid part of the PCB. In addition, the optical path is carried out over the flexible portion. 

Optical Connections

These interconnections with optical fibers and wires are added to ensure the PCB can transmit and receive signals. Optical connections allow the PCB to react as per the stimulus using lights. 


The circuits in the PCB allow the photoelectric components to send signals, amplify them, or filter unnecessary noise before transmission. These make the processing quick and reliable in high-tech devices. 

Features of Photoelectric Rigid PCBs

A photoelectric rigid PCB uses new packing substrates to fulfill high computing needs. Its main goal is to transmit the data collected from electrical signals to optical signals. 

All this work is done using electricity and how the photoelectric PCB responds to light. These PCBs are useful in sensors, high-tech computers, and types of machinery.

The PCBs will have features that correspond to the electrical components. Here are some of them: 

High-Speed Data Transmission

Photoelectric PCBs emit high-speed data transmission with their light-sensing components. This is possible with the help of faster electrical signal detection and emitting that data at a faster rate, even when the transmission distance is longer than usual. 

Low Electromagnetic Interference

These PCBs have lesser electromagnetic interference during signal transmission. This is ideal for devices that are sensitive in environments with high electromagnetic waves. The devices will be able to perform normally without any interaction. 

Compact Size

Photoelectric rigid PCBs are small in size, so they can fit into miniature devices and leave room to add more components. This is beneficial when there is a size and weight limit on the electronic devices. Portable high-tech devices are fit with these rigid PCBs.


These PCBs offer high reliability even when performing in extreme temperatures, mechanical stress, and humidity. As a result of this, new design devices can be made, raising the scope of HD PCBs with advanced features.


Miniaturization of electronics and high-definition features make photoelectric rigid PCBs versatile in design and functionality, resulting in reliable aerospace and automated electronics. Moreover, flexible medical devices and wearables with optical features can be made using photoelectric printed circuit boards. 


Photoelectric circuit boards are easy to customize for various applications. The designs can be customized for PCB layout, layers of substrate, vias, and electronics components over the rigid region.

How are Photoelectric Rigid PCBs Fabricated 

Several steps are followed when manufacturing PCBs to combine various layers on the board.


The initial step is to design the PCB components and layers, including all the circuits, holes and interconnects. Software such as Proteus, Altium, KiCad, Cadence, and DesignSpark may be used to design the circuit boards. 

Substrate Selection

A substrate material is crucial in PCB manufacturing. Fiberglass-reinforced epoxy laminate works best for rigid boards. Other choices include FR-1, G-10 to PTFE, alumina, and Kapton. 

Layer Printing

With the process of screen or inkjet printing, the circuit layout is printed over the substrate material. Via marks, traces, and pads may be printed in this step. 

Joining the Components Together

Several photoelectric components, like sensors and LEDs, are added to the substrate. In addition, surface mounting with integrated circuits and capacitors is completed. These are placed on the printed pre-fabricated components on the substrate. 


Excess copper is removed from the substrate, leaving only the required circuit pattern. This also adds definition to the conducting pathways and traces. 


Using CNC machines, holes are drilled in the PCB for mounting holes for components and vias. These holes help form interconnections and add more components. 

Surface Finish

Plating of hot air solder(HASL), silver immersion, and electroless nickel immersion gold(ENIG) is layered over the exposed copper circuit pattern. This protects the substrate from various environmental and temperature changes.

Solder Mask

A solder mask is added over the PCB as an insulation for the conductive traces. The next step is silk printing on the logos, reference numbers, and component names over the PCB. Lastly, the PCB undergoes quality testing to ensure it functions as intended.


  • Automated devices with sensors
  • High-speed data transmitters
  • Optical sensors
  • Medical devices
  • Radar and military communication systems

Wrapping Up 

Now you know all about photoelectric circuit boards and how they work with optical stimulus and its rapid detection. To fabricate a high-quality photoelectric rigid PCB, start with designing and adding the optical features you desire in the devices. Besides, you'll require premium components to add to the PCBs. Connect with reliable manufacturers for designing and manufacturing photoelectric PCBs. 

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